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November 22, 2024
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ONTRACK MONTHLY
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Mexico to See $890 Million of US Investment
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Silicon Valley firms and EMS companies plan $890M in Jalisco for 2025, fueling tech growth and job creation in the Mexican state.
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Cars Are Bringing Back Buttons
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Touchscreens have suddenly gone out of style as automobile manufacturers start bringing tactile buttons back to control consoles in new vehicles.
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Semiconductor Sales Up 23.2% YoY/10.7% QoQ
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The Semiconductor Industry Association reports sales reached $166 billion in Q3 2024 with the Americas region accounting for 46.3% of total sales.
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New Book on UHDI and Packaging Design
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Industry veteran Vern Solberg has released a new book covering UHDI PCBs; advanced packaging; and 2D, 2.5D, 3D and hybrid bond interconnects.
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The Future of FPGAs is Looking Uncertain
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Thanks to business models and focus shift from major players like Intel and AMD, it looks like low-end FPGAs will lead future market growth.
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Cost considerations in wire bonding and assembly may not be obvious if you don’t have experience. Luckily, Samer gives readers an expert view on cost considerations for wire bonding and chip-on-board designs.
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Signal integrity in multi-board systems is determined by the signal transmission capabilities of connectors, via transitions, and pinouts. See what determines signal integrity in board-to-board interconnects in this guide.
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Laser drilling will take you all the way down to tiny density interconnects used in ultra-HDI PCBs and substrates for IC packaging. Zach gives an overview of mechanical drilling limits that push designers into a laser drilling process.
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Common-mode chokes can be useful for filtering noise and EMI on coupled lines, but only if they are selected correctly. Learn more about selecting chokes without creating a new signal integrity problem.
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| ONTRACK PODCAST |
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HR 3249 Explained: How it Protects America's PCB Industry
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We’re happy to welcome David Schild back onto the Altium OnTrack podcast to discuss the excellent progress PCBAA has made advocating for American PCB manufacturers. Zach caught up with David at this year’s PCB West conference and discussed the organization’s progress, future outlook, and most important moments for legislators.
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New Videos & tutorials
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Wire Bonding Shorts: 3D Stacked Die with Cavity
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Wire bonding and chip-on-board designs can implement stacking of dies without TSVs as vertical interconnects. A simple way to do this is die stacking by using internal cavities to hold each die.
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| ► Watch Now |
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The Fastest Ways to Run a PCB BOM Review
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Run a BOM review early in the design process to spot required part swaps and verify inventories. You can leverage the built-in features in Altium Designer and the new BOM Portal in Altium 365 to quickly run a BOM review.
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► Watch Now
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ALTIUM ACADEMY
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Weekly Webinars
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Altium is pleased to offer free weekly webinars that cover basic and advanced challenges that designers and PCB engineers face.
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